Advanced Technologies

Advanced Technologies

A well-designed cooling solution is crucial for maximizing laptop performance.

MSI achieves this through carefully selected thermal paste, cutting-edge fan designs, and optimized airflow systems. This advanced expertise highlights MSI's commitment to leveraging advanced cooling technologies for superior laptop performance.

Thermal Paste

“Thermal Paste

Thermal paste is applied between the processor and the heatsink to fill tiny gaps, enhancing heat conductivity and reducing bubbles on the contact surface. Hence, MSI employs its proprietary phase-change thermal pads, achieving efficient heat transfer while avoiding issues like overflow or crystallization commonly seen in liquid metal thermal pastes.

Design Focus by MSI:
● Thermal conductivity :Traditional thermal pastes typically have a thermal conductivity coefficient of around 2W/mK. High-conductivity thermal pastes, such as compounds containing metal particles, are a key focus of R&D.

● Crack resistance :MSI laptops require thermal paste with excellent crack resistance to ensure long-term stability.

MSI's Exclusive Phase-Change Thermal Pads: With a highly efficient thermal conductivity coefficient of up to 8.5W/mK, three times more than traditional thermal pastes, these phase-change paste completely fill gaps between the CPU/GPU and the heat module. Their stable composition and reusability prevent overflow or crystallization issues common with liquid metal thermal pastes.

Heat Pipes

“Heat Pipes

Heat pipes are a heat transfer technology used to efficiently transfer heat from hot spots to heatsinks, improving overall heat dissipation. They typically consist of enclosed metal pipes and internal working fluids.

Design Focus by MSI:
● Material selection :Utilizing high thermal conductivity materials like copper, reaching up to 401W/mK, MSI combines copper heat pipes with aluminum die-cast heat modules to ensure efficient heat transfer.

● Pipe design :Considering the space constraints within laptops, MSI continuously tests and optimizes the shape, thickness, bending, and overall layout of heat pipes to ensure high thermal conductivity.

● Optimized internal fluids :MSI selects high-performance and optimum ratio working fluids to ensure rapid heat transfer to the heatsink.

Through these design adjustments, MSI laptops' heat pipe performance has improved by nearly 27%, meaning more heat can be removed from hotspots (i.e., CPU and GPU areas), allowing the laptop to maintain stable, sustained peak performance under optimal temperature control.

Fans

“Fans

Fans are the core components of the cooling system, tasked with transferring internally generated heat to the external environment to maintain hardware operation within appropriate temperature ranges. MSI laptop fan designs prioritize performance, noise, and energy efficiency.

Design Focus by MSI:
● Vortex blade design :Employing advanced blade designs for optimal airflow and noise reduction, MSI utilizes aerodynamic vortex shapes to achieve over 10% improvement in airflow compared to conventional blade structures at the same speed.

● Lightweight materials :Using lightweight yet sturdy materials in optimized fan sizes to reduce vibrations and noise during fan operation. For instance, MSI's renowned GS66 Stealth, to maximize airflow within limited chassis space, compresses blade thickness to an industry-leading 0.1mm, reducing blade thickness by 87%, with an ultimate 67-blade count, thus boosting overall airflow by 10%.

● Intelligent fan control :Implementing smart fan control to adjust speeds based on temperature and workload, ensuring optimal cooling effects. Users can easily adjust temperature and fan speeds through the graphical interface of MSI Center.

System Airflow

“System Airflow

System airflow refers to the airflow within the entire laptop interior. Good system airflow ensures that cooling air efficiently flows through internal components, enhancing overall heat dissipation efficiency.

Design Focus by MSI:
● Heat zone distribution :Properly configuring internal components to ensure even heat distribution and prevent high heat accumulation.

● Optimized cooling design :Considering the position of internal components, ventilation ports, and heat dissipation structures to ensure optimal airflow.

● Exterior structure for optimal airflow :Designing laptop shell structures to promote good airflow and reduce internal temperatures.

For example, MSI's flagship model GT76 Titan, compared to other market-leading flagship products, increases the intake area by 574% and the exhaust area by 15%, resulting in a total system airflow of 96 CFM, 125% higher than competing flagship models, solidifying Titan's position in performance.

Quality First, Users Always!